shenzhen kaifa technology co., ltd.-金沙贵宾厅

ic packaging

our ic packaging pipeline -- categorized into wbga, lga, fbga-ssd, and sip-emcp and usb packaging -- will manufacture a variety of products including dram, emcp, sip, ssd, and led dot matrix.

 • dram/flash product packaging testing

• led dot matrix

• lga packaging for fingerprint recognition chips

• ram module assembly